Samsung and Micron prep advanced HBM3E 3D chips for memory-intensive applications [TechSpot]

Despite entering the HBM3E market somewhat belatedly, Samsung is introducing its HBM3E 12H DRAM chips as a pioneering achievement in 3D layered memory technology. The latest memory chips from the Korean giant utilize a novel 12-layer stack, which can deliver a 50 percent increase in both performance and capacity compared…Read Entire Article