![intel-shows-off-glass-substrates-for-next-generation-advanced-chip-packages-[techspot]](https://i0.wp.com/upmytech.com/wp-content/uploads/2023/09/142921-intel-shows-off-glass-substrates-for-next-generation-advanced-chip-packages-techspot-scaled.jpg?resize=800%2C445&ssl=1)
Intel shows off glass substrates for next-generation advanced chip packages [TechSpot]
View Article on TechSpot
Intel has introduced what it is calling one of the first glass substrates for next-gen advanced packaging that will allow the industry to continue advancing Moore’s Law beyond 2030.