News Uncategorized Intel leans hard on advanced chip packaging technologies in battle for computing supremacy [VentureBeat] September 16, 2020 Thomas Giboney computers, home theater, Nintendo, playstation, projectors, receivers, Smart Home, speakers, surround sound, technology, televisions, video games, xbox Advanced packaging technologies allow Intel to mix and match transistors to optimize for performance, cost, and time to market. View Article on VentureBeat Business,2.5D Packaging,3D Packaging,Advanced Interface Bus,category-/Computers & Electronics/Computer Hardware/Computer Components,Co-EMIB,EMIB,Foveros 2.5D Packaging Spread the word!Click to share on Twitter (Opens in new window)Click to share on Facebook (Opens in new window)Click to share on LinkedIn (Opens in new window)